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8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments EUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 22.86 mm (900 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 11x-dip-switch SPST CTS_Series194-11MSTN, Piano, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size (see.

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