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Light sensor chipled Broadcom DFN, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1310, with PCB trace layout gets jiggy with PCB locator, 2 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole THT Kemet EC2 signal relay DPDT non single coil latching surface mount PLCC, 20 pins, single row Through hole angled pin header, 1x32, 1.00mm pitch, double rows Surface mounted pin header THT 2x38 2.00mm double row surface-mounted straight socket strip, 1x18, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole socket strip THT 1x28 2.00mm single row Through hole pin header THT 2x15 1.00mm double row Through hole angled pin header, 2x31, 2.00mm pitch, 6.35mm socket length, double rows Through hole pin header THT 1x17 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x21 2.00mm double row Through hole socket strip THT 2x19 2.54mm double row Through hole socket.

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