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SM02B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator TE, 826576-8, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-42XX, With thermal vias in pads, 5 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0430, 4 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.25 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.5mm, hole diameter 1.2mm THT rectangular pad as test point, loop diameter2.6mm, hole diameter 1.5mm THT pad rectangle.

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