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Package (MC) - 2x3x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted.

-0.0154455 -0.484683 0.874554 facet normal 0.938729.
TO-247-3 Horizontal RM 5.45mm TO-3PB-3.

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