3
1
Back

Pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTBV_2,5/16-GF-5,08; number of pins: 06; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1827994 8A 160V Generic Phoenix Contact connector footprint for: MSTBV_2,5/13-GF; number of pins: 03; pin pitch: 5.00mm; Angled || order number: 1777219 12A Generic Phoenix Contact connector footprint for: MC_1,5/8-G-3.5; number of pins: 03; pin pitch: 5.08mm; Angled || order number: 1843253 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/13-GF-5,08; number of pins: 04; pin.

New Pull Request