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LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket.

• 205-00011, 12 pins, pitch 5mm, size 60x10mm^2.
• 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865.

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