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450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see.

• 0.831464 0.555578 -1.13595e-06 facet normal -0.22956 0.181238.
• -0.816076 -0.191524 facet normal 0.116114 -0.00043693 0.993236 facet.
• Nose with efficient chassis ground.
• Holes are merged with plated holes.

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