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Bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 1x23 1.27mm single row Through hole angled pin header THT 2x27 2.00mm double row surface-mounted straight pin header, 1x18, 1.27mm pitch, double rows Through hole socket strip SMD 1x31 2.54mm single row Through hole angled pin header SMD 2x34 1.00mm double row Through hole straight socket strip, 2x33, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight.

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