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6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/16L_UQFN_4x4x0_5mm_JQ_C04257A.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105310-xx08, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PUD series connector, 53398-0271 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py.

DAMAGE. ======================================================================== Copyright (c) 2013 Joshua Tacoma.
0.261482 0.103782 0.959613 facet normal 0.977435 -0.186459.
6.921978e-01 1.520020e-04 vertex -1.027117e+02.

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