Labels Milestones
BackMm (451 mils 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL ZIF 25.4mm 1000mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package.
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