Labels Milestones
BackTechnology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic Micro Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 2.54 8-Lead Plastic SO, Exposed Die.
- (https://katalog.we-online.de/em/datasheet/9774010243.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin.
- Normal -0.243784 -0.297053 0.923217 vertex -6.46493 6.46493 3.76384.
- Locked, 10 contacts, compatible header: PANCON HE10.
- SMD 11x-dip-switch SPST , Slide, row spacing 9.53.
- 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch.