Labels Milestones
BackDefinition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297.
- V 5.2165449" d="m -3.444887,5.1181194 h.
- Hole_vert = (board_height - hole_vdist) / 2.
- -3.10499 -1.28613 18.4724 vertex 3.08346 -1.31835 18.4724.
- 0.42307 -0.690389 0.586835 vertex 5.85513 2.00281 19.9 facet.