3
1
Back

18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EB), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 1, Wuerth electronics 9774010482 (https://katalog.we-online.de/em/datasheet/9774010482.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr.

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