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With photo IC package for diode bridges, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 5.9 mm (232 mils), body.

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