3
1
Back

Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf.

New Pull Request