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CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 1x21, 2.00mm pitch, single row Through hole socket strip SMD 1x37 2.00mm single row Through hole pin header SMD 1x38 2.54mm single row Through hole IDC header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header, 2x23, 1.27mm pitch, double rows Through hole socket strip THT 1x12 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x27 2.54mm single row Surface mounted pin header SMD 1x39 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x26, 2.00mm pitch, 4.2mm pin length, single row Through hole straight socket strip.

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