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Ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 2x11, 2.54mm pitch, 8.51mm socket length, single row Through hole pin header SMD 2x11 1.27mm double row Through hole pin header THT 1x37 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x18, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header SMD 1x19 1.27mm single row Through hole horizontal IDC header THT 2x31 2.00mm double row Through hole angled pin header, 2x33, 1.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header THT 1x35 1.27mm single row style2.

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