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Removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline (SS)-5.30 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP Switch SPST Slide 8.61mm 338mil SMD LowProfile SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile SMD 10x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body.

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