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5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, RWH0032A.

• -3.120055e-03 2.393726e-01 facet normal 7.241379e-01 6.896552e-01 -0.000000e+00.
• Vertex -1.068114e+02 9.715134e+01 1.153663e+01 facet.
• 0.883075 -0.0703615 facet normal -0.0972815 0.989353 0.108241 facet.

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