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Bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP.

• (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62), generated with kicad-footprint-generator Molex 734 Male header.
• 1x1.5mm, rounded Pads, 0.3mm gap.
• 6.86157 -7.38961 2.58057 vertex -9.81063.

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