Labels Milestones
BackBody [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row.
- F0 "Pots, switches, misc.
- ACP CA9-H3,8, http://www.acptechnologies.com/wp-content/uploads/2017/05/02-ACP-CA9-CE9.pdf Potentiometer vertical.
- (end 1.53 2.565 (end 1.53.
- 0) + knob_height .