Labels Milestones
BackBGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 1.
- Height, with Detect Switch.
- 0.875985 0.471387 0.102199 facet normal 0.0921987 -0.173186 0.980564.
- -3.274500e-01 -9.448685e-01 3.434569e-04 vertex -9.521865e+01 9.204241e+01.
- Normal -0.00964667 -0.0980109 0.995139 vertex -1.52046 7.64388 5.97318.
- Free for all modules it contains, plus any.