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1x16, 2.00mm pitch, double rows Through hole straight socket strip, 2x23, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 2x18, 1.27mm pitch, double rows Surface mounted pin header SMD 1x40 1.00mm single row style2 pin1 right Through hole angled pin header, 1x08, 1.00mm pitch, 2.0mm pin length, single row Through hole pin header THT 2x17 2.00mm double row surface-mounted straight pin header, 2x33, 1.27mm pitch, double rows Through hole pin header SMD 1x27 2.00mm single row Through hole pin header THT 1x07 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x22 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x31 2.54mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 20 pins, surface mount SMD Kemet EC2 signal relay DPDT double dual coil latching surface mount PLCC, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430fr5731.pdf#page=111 JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times.

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