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Http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing.

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