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BackPrinting/Panels/image.png differ From 52b504dd7cabbf7261c98563d42b1772d3bf6825 Mon Sep 17 00:00:00 2001 Subject: [PATCH 07/13] Update Schematics/schematic_bugs_v1.md Schematics/schematic_bugs_v1.md | 1 | 1uF | Film capacitor | | J7, J8, J9 | 1 | SW_Push | Push button switch, generic, separate symbols, four pins D Push button switch with LED, generic K switch normally-open pushbutton push-button D MEC 5G single pole double throw K switch dual double-pole single-throw OFF-ON D Single Pole Single Throw (SPST) switch, separate symbol D 9x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D 10x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D 3x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D Switch, single pole normally-open tactile switch Omron B3F right angle (source: https://www.cnctech.us/pdfs/C-ARA1-AK512.pdf USB C Type-C Receptacle Hybrid CNCTech C-ARA1-AK51X USB Type C, Right Angle, Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89011xx, 11 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B5P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-18P-DLT1, 9 Circuits (https://www.molex.com/pdm_docs/sd/2005280090_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/436412f.pdf#page=22), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP24: plastic shrink small outline package; 28 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 10 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 horizontal, leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (5mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 12-Lead Plastic Micro Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-9)), generated with kicad-footprint-generator Soldered wire connection with feed through.
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