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400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 9.53 mm (375 mils SMD DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay Standex-Meder SIL-relais, UMS, see http://cdn-reichelt.de/documents/datenblatt/C300/UMS05_1A80_75L_DB.pdf Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-176 , 16 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0308, 30 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 5569-12A1, example for new part number: 26-60-4130, 13 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for a pot, an LED, and a big part of a pot rotary_knob_row = top_row - 30; left_rib_x = thickness * 1; right_rib_x = width_mm.

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