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Technologies BMI-S-203-F Shielding Cabinet THT 26x26mm WE-SHC Shielding Cabinet One Piece SMD 50.8x38.1mm WE-SHC Shielding Cabinet Two Piece SMD 44.00x30.50mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies BMI-S-105 Shielding Cabinet THT 61x61mm Signal Relay, 10x6mm, 2 Form C, Gull Wings, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Data+Sheet%7F108-98001%7FZ.1%7Fpdf%7FEnglish%7FENG_DS_108-98001_Z.1.pdf TE IM-Series Relay DPDR Pitch 5.08 IM Signal Relay SPDT Omron Serie G6EK, see http://www.logosfoundation.org/instrum_gwr/pi/Omron_G6E_134P.pdf Relay SPDT Finder 40.11 Relay DPDT Form C http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=RT2_reflow&DocType=DS&DocLang=EN Relay SPST Potter&Brumfield T9AP1D52 12V 30A 1xUn Connector Fast ON Only Dummy for Space NO Pads Relay SPDT Omron Serie G5Q Panasonic Relay SPST, https://www3.panasonic.biz/ac/e_download/control/relay/power/catalog/mech_eng_lfg.pdf Bourns rotary encoder, EC12E..., vertical shaft, https://www.bourns.com/docs/product-datasheets/pec12r.pdf Sensortech MiCS MEMS sensor Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense MEMS I2S Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S ICS-43434 TDK InvenSense MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/39935c.pdf#page=152), generated with kicad-footprint-generator Molex LY 20 series connector, 502382-1070 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0210, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (https://www.ti.com/lit/ds/symlink/tps43060.pdf#page=40), generated with kicad-footprint-generator Hirose DF13 through hole, DF63M-3P-3.96DSA, 3 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 56 leads (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Horizontal RM 1.7mm staggered type-2 TO-220-7.

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