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14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256.

• Out_row_1; out_row_7 = working_increment*6 + out_row_1.
• WLCSP-156, ST die ID 480.
• 1mm soldermask opening (Level B Circular Fiducial.

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