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JTE06 Dual Crystal THT HC-52/U, http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/XS71xx.pdf Crystal THT DS15 5.0mm length 1.5mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/DS-Series.pdf SMD Crystal Seiko Epson SG-8002CE https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 3.2x2.5mm^2 package crystal Epson Toyocom FA-238 https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, 3.2x2.5mm^2 package SMD Resomator/Filter Murata SFECV, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD Crystal TXC 7M http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal SERIES SMD2520/2 http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST KingTek_DSHP03TJ, Slide, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://www.silabs.com/documents/public/data-sheets/Si5351-B.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-0410, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-2410, 24 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-BE-A, 29 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 16 pin, 4x4mm, 2.1mm sq pad (http://www.analog.com/media/en/technical-documentation/data-sheets/ADG633.pdf LFCSP, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-12A example for new part number: 09-65-2108, 10 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xxx-DV, 14 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad LQFP, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-9.

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