Labels Milestones
BackOf 8-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 14-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 10.16 mm (400 mils 10-lead though-hole mounted.
- Panels, to make fitting inside.
- Rails v_wall(h=4, l=height-rail_clearance*2-thickness, th=thickness*1.25.
- For: MCV_1,5/11-G-3.5; number of pins: 05; pin pitch.