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MOLD package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82493/tsop311.pdf package for diode bridges, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 7.62mm 300mil reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf.

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