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TO-262-3 Horizontal RM 5.45mm TO-247-4, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 2.54mm staggered type-1 TO-247-2, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.7mm MultiwattF-11 staggered type-1 TO-220F-4, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-9 Vertical RM 2.54mm TO-126-3, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Horizontal RM 2.54mm TO-247-4, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 1.27mm MultiwattF-15 staggered type-2 TO-220-4, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Vertical RM 1.7mm MultiwattF-11 staggered type-1 TO-220F-2, Horizontal, RM 2.54mm TO-220-4, Horizontal, RM 2.286mm SIPAK, Vertical, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 2.54mm IIPAK I2PAK TO-264-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-7, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220-9, Vertical, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279.

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