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Level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die.

• So plenty of room.
• 35 .../Kosmo_Panel_Mounting_Hole.kicad_mod | 17 .../fastestenv_Switch_Hole.kicad_mod | 17 .../Kosmo_Jack_Hole_NPTH.kicad_mod.
• 5.00013 0 vertex -5.96308 8.22545 2.19603 facet.

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