Labels Milestones
BackDSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x26 1.27mm double row Through hole straight socket strip, 2x31, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x05 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x03 2.54mm double row Through hole pin header SMD 1x24 1.00mm single row Through hole angled pin header SMD 2x21 2.00mm double row Through hole angled socket strip, 1x36, 1.27mm pitch, double rows Through hole angled pin header, 2x02, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole pin header THT 2x02 2.00mm double row surface-mounted straight pin header, 2x12, 1.27mm pitch, double rows Through hole angled socket strip SMD 1x03 1.00mm single row Through hole pin header THT 2x03 1.27mm double row surface-mounted straight socket strip, 1x05, 2.54mm pitch, 6mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole IDC box header 2x12 2.54mm double row Through hole IDC header, 2x30, 1.00mm pitch, 2.0mm pin length, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 2x31, 1.27mm pitch, double rows Through hole pin header THT 2x01 1.27mm double row Through hole angled pin header SMD 2x38 2.54mm double row Through hole angled pin header THT 2x33 1.27mm double row surface-mounted straight pin header, 2x36, 2.00mm pitch, double rows Through hole straight pin header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x13, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package.
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