3
1
Back

V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL ZIF 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole.

New Pull Request