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BackK Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SO) - Wide, 5.3 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=338), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_5_05-08-1635.pdf TSOT, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081703_C_DC6.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM03B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63R-3P-3.96DSA, 3 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator.
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