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Horizontal angled 90deg THT female pitch 2.77x2.84mm pin-PCB-offset 14.56mm mounting-holes-distance 25mm mounting-hole-offset 25mm 15-pin D-Sub connector horizontal angled 90deg THT male pitch 2.29x1.98mm mounting holes to PCB edge 11.32mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 9-pin D-Sub connector horizontal angled 90deg THT male pitch 2.29x2.54mm pin-PCB-offset 9.4mm 37-pin D-Sub connector horizontal with green/yellow LEDs http://www.kycon.com/Pub_Eng_Draw/G7LX-A88S7-BP-GY.pdf 1 Port, RJ45, Series 85513, vertical, SMD, https://www.molex.com/pdm_docs/sd/855135013_sd.pdf 1 port ethernet throughhole connector, https://en.ninigi.com/product/rj45ge/pdf RJ45 vertical connector Molex PicoBlade Connector System, 53047-0510, 5 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, SM03B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector Molex KK-254 Interconnect System, old/engineering part number: A-41792-0006 example for new mpn: 39-28-x08x, 4 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Molex MicroClasp horizontal Molex SPOX Connector System, 43045-1221 (alternative finishes: 43045-240x), 12 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 20 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083)), generated with kicad-footprint-generator ipc_noLead_generator.py DC6 Package; 6-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300.

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