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Stencil (https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 14-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf SSOP, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67), generated with kicad-footprint-generator Capacitor SMD 3640 (9110 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator JST AUH series connector, S12B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with StandardBox.py) (https://www.bourns.com/docs/Product-Datasheets/SRF1260.pdf Bourns SRP1245A SMD inductor https://datasheet.lcsc.com/lcsc/2009171439_TAI-TECH-TMPC1265HP-100MG-D_C305223.pdf, 13.5x12.5x6.2mm Tai Tech TMPC1265 series SMD inductor Bourns SRU8043 SMD inductor Bourns SRP1770TA series SMD inductor https://www.bourns.com/pdfs/SRR1208.pdf Bourns SRP1208 series SMD SMT crystal oscillator Miniature Crystal Clock Oscillator ECS 2520MV series SMD inductor, https://www.bourns.com/docs/Product-Datasheets/SRN4018.pdf Bourns SRN4018 series SMD SMT ceramic resonator filter DSN6 Ceramic Resomator/Filter Murata SFECV, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 7.9x3.8mm^2 package Diode MicroSMP (DO-219AD), large-pad anode, https://www.vishay.com/docs/89457/msmp6a.pdf Infineon SG-WLL-2-3, 0.58x0.28x0.15mm, https://www.infineon.com/dgdl/Infineon-SG-WLL-2-3_SPO_PDF-Package-v02_00-EN.pdf?fileId=5546d46271bf4f9201723159ce71239d SOD962-2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 20 mm fuse holders; Vertical w/ Stability Pins; 250V; 6.3-16A (http://www.cooperindustries.com/content/dam/public/bussmann/Electronics/Resources/product-datasheets/Bus_Elx_DS_2118_HB_PCB_Series.pdf 5 mm x 20 mm, Slotted Cap, horizontal, 500 VAC 4W/16A (VDE), 600V 30A (UL/CSA), order numbers: 0031.2520 (0031.2500 + 0031.2323), http://www.schurter.ch/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_FUP.pdf Fuseholder 6.3x32mm horizontal closed Maxi APX ATX Automotive Blade Fuse Clip Holder https://www.keyelco.com/userAssets/file/M65p40.pdf Maxi APX ATX Automotive Blade Fuse Clip Holder https://www.keyelco.com/userAssets/file/M65p40.pdf Maxi APX ATX Automotive Blade Fuse Clip Holder Littelfuse NANO2 holder, https://www.littelfuse.com/~/media/electronics/datasheets/fuses/littelfuse_fuse_154_154t_154l_154tl_datasheet.pdf.pdf Littelfuse NANO2 holder, https://www.littelfuse.com/~/media/electronics/datasheets/fuses/littelfuse_fuse_154_154t_154l_154tl_datasheet.pdf.pdf Littelfuse NANO2 holder, https://www.littelfuse.com/~/media/electronics/datasheets/fuses/littelfuse_fuse_157_datasheet.pdf.pdf Fuse, Fuseholder, TR5, Littelfuse/Wickmann, No. 460, No560, Fuse TE5 Littelfuse/Wickmann No. 460 No560 Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89014xx, 14 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1210, with PCB locator, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xx-DV-TE, 17 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-3)), generated with kicad-footprint-generator connector JST VH top entry JST VH PBT series connector, 502386-0570 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm.

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