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Mosfet hsof toll thermal vias in pads, 4 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System.

• 4.605903e+000 -1.681500e-003 vertex -5.014100e+000.
• DIL, 4.5x4mm² PhotoDiode plastic SMD.
• 1766233 12A 630V Generic.

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