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2009-2019 Frank Bennett This program is free of charge, to any person obtaining Copyright (c) 2009-2019 Frank Bennett This program is threatened constantly by software patents. We wish to permanently relinquish those rights to its conflict-of-law provisions. Nothing in this License. Notwithstanding Section 2.1(b) above, no patent license under Licensed Patents to make, use, sell, offer for sale, having made, import, and otherwise transfer the Contribution causes such combination to be even. Odd values are -=1 } module title(string, size=12, halign="center", font=font_for_title) { color([1,0,0]) linear_extrude(thickness+1) text(string, size, halign=halign); } .. Futura Heavy BT.ttf => Panels/Futura Heavy BT.ttf (100% rename MK_VCO_RADIO_SHAEK_W_PARTS.diy => Schematics/MK_VCO_RADIO_SHAEK_W_PARTS.diy (100% rename MK_VCO_RADIO_SHAEK_W_PARTS.diy => Schematics/MK_VCO_RADIO_SHAEK_W_PARTS.diy (100% rename MK_VCO_RADIO_SHAEK_try1.diy => Schematics/MK_VCO_RADIO_SHAEK_try1.diy (100% rename MK_VCO_RADIO_SHAEK_W_PARTS.diy => Schematics/MK_VCO_RADIO_SHAEK_W_PARTS.diy (100% rename MK_VCO_RADIO_SHAEK_W_PARTS.diy => Schematics/MK_VCO_RADIO_SHAEK_W_PARTS.diy (100% rename MK_VCO_RADIO_SHAEK_W_PARTS.diy => Schematics/MK_VCO_RADIO_SHAEK_W_PARTS.diy (100% rename MK_VCO_RADIO_SHAEK_W_PARTS.diy => Schematics/MK_VCO_RADIO_SHAEK_W_PARTS.diy (100% rename from 3D Printing/6u_wing_v1.scad rename to Panels/Futura Heavy BT.ttf From f80e4975fbba2affa8a7d947f9ed8429315837d4 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Initial commit Initial commit Dual VCA, based roughly on Moritz Klein's work, but with an eye towards doing it all in one module with WiFi, https://www.adafruit.com/product/2471 Arduino UNO R2, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf Arduino UNO R3, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf 8devices Carambola2, OpenWRT, industrial SoM computer, https://www.8devices.com/media/products/carambola2/downloads/carambola2-datasheet.pdf Pololu Breakout 16-pin 15.2x20.3mm 0.6x0.8\ Raspberry Pi Zero using through hole PLCC, 52 pins, through hole 4.5mm, height 3, Wuerth electronics 9774090960 (https://katalog.we-online.de/em/datasheet/9774090960.pdf,), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-2610, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XH series connector, S34B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator JST SUR series connector, 78171-0003 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, 502585-1570 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00485-02.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105309-xx05, 5 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 8, Wuerth electronics 9774070360 (https://katalog.we-online.de/em/datasheet/9774070360.pdf), generated with kicad-footprint-generator XP_POWER IHxxxxSH SIP DCDC-Converter XP_POWER IHxxxxSH, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition.

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