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Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems SIP-4, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm LFCSP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 44 pins, through hole M2, height 3, Wuerth electronics 9774060943 (https://katalog.we-online.de/em/datasheet/9774060943.pdf), generated with kicad-footprint-generator JST PHD vertical JST EH series connector, 14110513010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-11A example for new mpn: 39-30-0220, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 100-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x17 1.27mm double row Through hole angled socket strip, 2x22, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x36 1.00mm double row Through hole straight pin header, 1x07, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x40 2.54mm single row Through hole pin header SMD 1x20 2.54mm single row style2 pin1 right Through hole angled socket strip, 2x26, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole angled pin header, 1x19, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x01, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x22 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x20 2.00mm single row style2 pin1 right Through hole pin header THT 2x40 2.00mm double row Through hole straight pin header, 2x38, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 2x12 2.54mm double row surface-mounted straight pin header, 2x08, 2.54mm pitch, double rows Surface mounted pin header SMD 1x23 1.00mm single row Surface mounted pin header SMD 1x38 2.54mm single row Surface mounted socket strip THT 2x30 2.54mm double.

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