3
1
Back

ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x34 1.00mm single row Through hole straight socket strip, 1x26, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole angled socket strip, 2x07, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x32 2.00mm double row Through hole IDC header, 2x32, 1.00mm pitch, double rows Surface mounted socket strip THT 1x32 1.00mm single row Through hole angled pin header, 2x27, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x39, 2.54mm pitch, DIN.

New Pull Request