Labels Milestones
BackOmron_A6S-410x, Slide, row spacing 15.24 mm (600 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted.
- Jfet (~50¢) and H11F1M ($5!) optocoupler.
- [QFN]; (see Microchip Packaging.
- 2.7mm, M2.5, DIN965 mounting hole 4.5mm.