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&& Various updates, additions Fix for component clearance, panel thickness from printer realities Fix for component clearance, panel thickness from printer realities bugfix/10hp More layout updates Delete 'Panels/futura medium condensed bt.ttf' 16055f0ae5 Delete 'Panels/futura medium condensed bt.ttf | Bin 0 -> 317907 bytes Images/PXL_20210831_004139245.jpg | Bin 0 -> 11930 bytes create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/drill_report.rpt create mode 100644 Fireball/Fireball_panel.kicad_pcb 2666d5803f Footprint selection, some PCB layout choices Add CV in to pause the sequence. Probably can't do, or impractical: - CV-controlled CV offset module - add a voltage to another voltage. Useful here for pitching up from a Contributor which are actually 8.8mm but require more on the rails v_wall(h=4, l=height-rail_clearance*2-thickness, th=thickness*1.25); v_wall(h=4, l=height-rail_clearance*2, th=right_rib_thickness); //outline of whole PCB? // cube([137.5, 97, 1], center=true); working_increment = working_height / 5; out_row_2 = working_increment*1 + row_1; working_increment = (working_height-v_margin+thickness) / (9); // generally-useful spacing amount for vertical columns of stuff // step rotary switch? Special: this needs measuring, and leaving space for everything, lining things up more More work finding space for a single 1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Pico-Clasp series connector, B24B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator JST XA series connector, B3B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST SH series connector, BM04B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1230, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.75 mm² wire, reinforced insulation, conductor diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with.

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