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SPST CTS_Series194-11MSTN, Piano, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x04 1.00mm single row Through hole socket strip THT 2x06 2.54mm double row Through hole straight pin header, 2x01, 2.00mm pitch, 6.35mm socket.

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