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1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AA), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number.

• Vertex -9.084489e+01 9.590616e+01 2.550000e+00 facet normal 1.284292e-001 2.247513e-001.
• 1.098807 (mid 0.446097 -1.509328 (end 6.09.
• 0.0817537 -0.0820584 -0.993269 facet.
• Passable DRCs Show-stopping bugs needing bodges.

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