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Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5.

• Length 48mm width 12.5mm height.
• Shapes (rectangular, gear shaped etc.). * @todo Add.
• 2x2x0.9 mm Body [UQFN]; (see Microchip Packaging.

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