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20-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7811045, 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 4, Wuerth electronics 9774010982 (https://katalog.we-online.de/em/datasheet/9774010982.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.8mm; see section 7.4.

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