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Bridges, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 4-lead.

Changjiang, FNR4020S, 4.0x4.0x2.0mm, https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf Inductor, Changjiang.
Https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv25-ef_en.pdf tdk nlv25 nlcv25 nlfv25 TDK NLV32, 3.2x2.5x2.2mm.
Normal -1.932563e-01 2.598328e-03 -9.811449e-01.
Normal -0.137351 0.452781 0.880979 facet normal 0.479355 0.871971.
MC_1,5/12-GF-5.08; number of pins: 11.

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