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38.1mm 1.5inch single digit 7 segment orange, common anode, 7.62x7.62mm, BGRA pin order, https://cdn-shop.adafruit.com/datasheets/BL-FL7680RGB.pdf RGB LED Piranha Super-Flux BetLux LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm, 2 pins diameter 5.0mm z-position of LED center 3.0mm 3 pins Ceramic Resomator/Filter 7.0x2.5mm^2, length*width=7.0x2.5mm^2 package, package length=7.0mm, package width=2.5mm, 3 pins IR-LED, diameter 3.0mm, 3 pins, pitch 10mm, size 105x9mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF11 through hole, DF11-6DP-2DSA, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/AVX-HV_MLCC.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-80DP-0.5V, 80 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VSON 10 Thermal on 11 3x3mm Pitch 0.5mm Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-V (7361-38 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade Connector System, 5267-05A, 5 Pins per row (https://www.hirose.com/fr/product/document?clcode=CL0580-2218-5-05&productname=FH41-30S-0.5SH(05)&series=FH41&documenttype=2DDrawing⟨=fr&documentid=0001001704 connector Hirose DF12 vertical Hirose DF13C vertical Hirose DF12C SMD, DF12C3.0-60DS-0.5V, 60 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SUR series connector, S03B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power.

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